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Microchips and Electronics

Single-part and Small-scale Production of Ceramic Modules

  • Purpose: Applied for manufacturing radioelectronic modules with 3D topology as well as modules operating within microwave ranges.
  • Year of release: 2013
  • Guaranteed service life (years): Depends on product requirements.
  • Estimated production / delivery time (months): Based on the degree of product complexity.
  • Flight qualification of the product: No
  • Possibility to adapt the product to customer requirements: Yes
ParameterValue
Maximum module size, mm100х100
Minimum conductor size, µm120
Minimum conductor to conductor clearance, µm120
  • Manufacturing of ceramic modules in accordance with LTCC-technology.